IPD50P04P4L-11 optimos ? -p2 power-transistor features ? p-channel - logic level - enhancement mode ? aec qualified ? msl1 up to 260c peak reflow ? 175c operating temperature ? green product (rohs compliant) ? 100% avalanche tested ? intended for reverse battery protection maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25c, v gs =-10v 1) -50 a t c =100c, v gs =-10v 2) -40 pulsed drain current 2) i d,pulse t c =25c -200 avalanche energy, single pulse e as i d = -25a 18 mj avalanche current, single pulse i as - -50 a gate source voltage v gs - 16 3) v power dissipation p tot t c =25c 58 w operating and storage temperature t j , t stg - -55 ... +175 c iec climatic category; din iec 68-1 - - 55/175/56 value v ds -40 v r ds(on),max 10.6 m w i d -50 a product summary pg-to252-3-313 type package marking IPD50P04P4L-11 pg-to252-3-313 4p04l11 rev. 1.0 page 1 06.08.2010
IPD50P04P4L-11 parameter symbol conditions unit min. typ. max. thermal characteristics 2) thermal resistance, junction - case r thjc - - - 2.6 k/w smd version, device on pcb r thja minimal footprint - - 62 6 cm 2 cooling area 4) - - 40 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0v, i d = -1ma -40 - - v gate threshold voltage v gs(th) v ds = v gs , i d =-85a -1.2 -1.7 -2.2 zero gate voltage drain current i dss v ds =-32v, v gs =0v, t j =25c - -0.03 -1 a v ds =-32v, v gs =0v, t j =125c 2) - -7 -70 gate-source leakage current i gss v gs =-16v, v ds =0v - - -100 na drain-source on-state resistance r ds(on) v gs =-4.5v, i d =-30a - 12.3 17.2 m w v gs =-10v, i d =-50a - 8.2 10.6 values rev. 1.0 page 2 06.08.2010
IPD50P04P4L-11 parameter symbol conditions unit min. typ. max. dynamic characteristics 2) input capacitance c iss - 3000 3900 pf output capacitance c oss - 1100 1400 reverse transfer capacitance c rss - 37 74 turn-on delay time t d(on) - 12 - ns rise time t r - 9 - turn-off delay time t d(off) - 46 - fall time t f - 39 - gate charge characteristics 2) gate to source charge q gs - 11 14 nc gate to drain charge q gd - 8 16 gate charge total q g - 45 59 gate plateau voltage v plateau - -3.6 - v reverse diode diode continous forward current 2) i s - - -50 a diode pulse current 2) i s,pulse - - -200 diode forward voltage v sd v gs =0v, i f =-50a, t j =25c - -1 -1.3 v reverse recovery time 2) t rr v r =-20v, i f =50a, d i f /d t =-100a/s - 40 - ns reverse recovery charge 2) q rr - - 32 - nc t c =25c values v gs =0v, v ds =-25v, f =1mhz v dd =-20v, v gs =-10v, i d =-50a, r g =3.5 w v dd =-32v, i d =-50a, v gs =0 to -10v 2) specified by design. not subject to production test. 4) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. 3) v gs =+5v/-16v according aec; v gs =+16v for max 168h at t j =175c 1) current is limited by bondwire; with an r thjc = 2.6k/w the chip is able to carry 60a at 25c. rev. 1.0 page 3 06.08.2010
IPD50P04P4L-11 1 power dissipation 2 drain current p tot = f( t c ); v gs - 6 v i d = f( t c ); v gs - 6 v 3 safe operating area 4 max. transient thermal impedance i d = f( v ds ); t c = 25 c; d = 0 z thjc = f( t p ) parameter: t p parameter: d = t p / t 1 s 10 s 100 s 1 ms 1 10 100 1000 0.1 1 10 100 -v ds [v] - i d [ a ] single pulse 0.01 0.05 0.1 0.5 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 -3 10 -2 10 -1 10 0 10 1 t p [s] z t h j c [ k / w ] 0 10 20 30 40 50 60 70 0 50 100 150 200 t c [c] p t o t [ w ] 0 10 20 30 40 50 60 0 50 100 150 200 t c [c] - i d [ a ] rev. 1.0 page 4 06.08.2010
IPD50P04P4L-11 5 typ. output characteristics 6 typ. drain-source on-state resistance i d = f( v ds ); t j = 25c r ds(on) = f( i d ); t j = 25c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. drain-source on-state resistance i d = f( v gs ); v ds = -6v r ds(on) = f( t j ); i d = -50a; v gs = -10v parameter: t j 5 6 7 8 9 10 11 12 13 14 -60 -20 20 60 100 140 180 t j [c] r d s ( o n ) [ m w ] -3 v -3.5 v -4 v -4.5 v -5 v -10 v 0 20 40 60 80 100 120 140 160 180 200 0 1 2 3 4 5 6 -v ds [v] - i d [ a ] -4v -4.5v -5v -10v 5 10 15 20 0 30 60 90 120 150 180 -i d [a] r d s ( o n ) [ m w ] -55 c 25 c 175 c 0 20 40 60 80 100 120 140 160 1 2 3 4 5 -v gs [v] - i d [ a ] rev. 1.0 page 5 06.08.2010
IPD50P04P4L-11 9 typ. gate threshold voltage 10 typ. capacitances v gs(th) = f( t j ); v gs = v ds c = f( v ds ); v gs = 0 v; f = 1 mhz parameter: i d 11 typical forward diode characteristicis 12 drain-source breakdown voltage if = f(v sd ) v br(dss) = f(t j ); i d = -1ma parameter: t j 25 c 175 c 10 0 10 1 10 2 10 3 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -v sd [v] - i f [ a ] -85a -850a 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 -60 -20 20 60 100 140 180 t j [c] - v g s ( t h ) [ v ] ciss coss crss 10 1 10 2 10 3 10 4 0 5 10 15 20 25 30 -v ds [v] c [ p f ] 35 36 37 38 39 40 41 42 43 44 45 -60 -20 20 60 100 140 180 t j [c] - v b r ( d s s ) [ v ] rev. 1.0 page 6 06.08.2010
IPD50P04P4L-11 13 typ. gate charge 14 gate charge waveforms v gs = f(q gate ); i d = -50a pulsed parameter: v dd 32v 8v 0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 q gate [nc] - v g s [ v ] v gs q gate v g s(th) q g (th) q g s q g d q sw q g rev. 1.0 page 7 06.08.2010
IPD50P04P4L-11 published by infineon technologies ag 81726 munich, germany ? infineon technologies ag 2010 all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev. 1.0 page 8 06.08.2010
IPD50P04P4L-11 revision history version revision 1.0 changes final data sheet date 6/8/2010 rev. 1.0 page 9 06.08.2010
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